Ceramics are widely used in semiconductor processing equipment where wiring is becoming finer and more multilayered. For lithography equipment, lightweight ceramics with high rigidity are expanding. For etching and deposition equipment, in addition to ceramics with plasma resistance and low particle count, ceramics with heat resistance and low dielectric loss are expanding. For wafer transfer arms, ceramics with high precision and excellent mechanical properties are adopted. Sapphire is used for windows, wafer carrier plates, wafer contact lift pins, plasma introduction tubes, etc. that require optical transparency. Product examples Ceramic Wafer Boat (Wafer Carrier) Alumina wafer boats offer excellent heat, wear, and chemical resistance. They feature a segmented design, allowing for easy replacement parts. Heat Resistance Wear Resistance Heat Resistance Wear Resistance Fine Cordierite ® Low Thermal Expansion Mirror High stiffness allows for a thinner and lighter-weight component High Stiffness Low Thermal Expansion Low Thermal Expansion ESD Tweezers Developed for products and processes sensitive to electrostatic breakdown. Semiconductive Chemical Stability Chemical Stability Heat Dissipation Structure Ceramic Substrates Monolithic ceramic structure with no bonding material for long-term reliability. Design flexibility High-Temperature Durability Design flexibility High-Temperature Durability Lamp Tubes Parts that utilize the light transmittance, heat resistance and insulating properties of sapphire. Heat Resistance Insulation Property Heat Resistance Insulation Property Handling Arms Heat-resistant, non-damaging handling arms provide high functionality. Heat Resistance Heat Resistance Heaters for Semiconductor Processing Equipment High-performance heaters utilize high thermal conductivity and plasma resistance. High Thermal Conductivity Plasma Resistance High Thermal Conductivity Plasma Resistance Electrostatic Chucks (ESCs) Highly plasma-resistant chucks perform well in a wide range of operating temperatures. Plasma Resistance Plasma Resistance Vacuum Chucks, Integrated Mirrors for Stages, Stage Parts High-precision vacuum chucks with various surface profiles/patterns for diverse operating conditions. High Stiffness High-Precision Domes, Chambers High-purity materials with high durability offer reliable plasma resistance. Uniform Electrical Properties Plasma Resistance Uniform Electrical Properties Plasma Resistance LCD Processing Equipment Parts Rigid ceramic parts for liquid crystal display processing equipment. High Stiffness Low Reflection Dressing Plates for Polishing Pads DLC coating improves the lifetime of dressing tools. Durability Anti-Plasma Materials Kyocera's plasma-resistant materials help create the next generation of etching technology. Plasma Resistance Low Dielectric Loss Plasma Resistance Low Dielectric Loss SiC (Silicon Carbide) Polishing Plates Less deformation through lower thermal distribution. Stronger chemical resistance. A range of surface profiles are available. High Young's Modulus Low Thermal Expansion High Young's Modulus Low Thermal Expansion Polishing Plates High-purity alumina ceramics are used for excellent rigidity and wear resistance. High Hardness Wear Resistance Wear Resistance Sapphire Handling Arms (End Effectors) Superior heat resistance and plasma resistance are ideal for semiconductor processing equipment. Heat Resistance Plasma Resistance

Heat Resistance Plasma Resistance Chamber Windows Kyocera's ultra-pure sapphire is both plasma and heat resistant. Heat Resistance Plasma Resistance Heat Resistance Plasma Resistance Carrier Plates for GaAs Wafers Kyocera's ultra-pure sapphire carrier plates for GaAs wafers. Heat Resistance Plasma Resistance Heat Resistance Plasma Resistance Wafer Boats Semiconductor processing equipment utilizes sapphire's plasma- and heat-resistant properties. Heat Resistance Plasma Resistance Heat Resistance Plasma Resistance Lift Pins Kyocera's ultra-pure sapphire lift pins. Heat Resistance Plasma Resistance Heat Resistance Plasma Resistance Plasma Generation, Introduction Tubes, Microwave Introduction Tubes Tube-shaped parts exhibit superior plasma resistance and low dielectric loss. Heat Resistance Plasma Resistance Heat Resistance Plasma Resistance Feedthroughs (Multi-pin) Multi-pin terminal feedthroughs are based on advanced ceramic-to-metal bonding technology. Airtightness Bonding Technology Bonding Technology Feedthroughs (Coaxial) Used in a wide range of applications, from radiation light sources and nuclear science to industrial equipment. Airtightness Bonding Technology Bonding Technology Isolator Flanges Ceramic isolator flanges used in advanced experimental laboratories. Airtightness Bonding Technology Bonding Technology Feedthroughs Highly reliable feedthroughs are proven components in a range of industrial sectors. Airtightness Bonding Technology Bonding Technology Sapphire Windows with Vacuum Flange The combination of our materials and bonding technologies produces sapphire windows with outstanding performance in ultra-high vacuum environments. Airtightness Bonding Technology Bonding Technology Hermetic Subminiature D type Ceramic Feedthroughs Subminiature D type Ceramic Feedthroughs have good hermetic properties for Ultra High Vacuum Application. Insulation Property Airtightness Insulation Property Special Brazed Feedthroughs Brazed with aluminum or non-magnetic metals is available. High Thermal Conductivity Insulation Property High Thermal Conductivity Insulation Property Vacuum Interrupter Ceramic Tube Ceramic Insulator Tubes are used in vacuum interrupters for medium voltage switch gear (approx. 6kV to 80kV). Insulation Property Airtightness Insulation Property Fine Ceramics (Advanced Ceramics) Product Categories Semiconductor Processing Equipment